| Autor: |
Baukje Wisse, Paul van Adrichem, Stefan Hunsche, Peter Nikolsky, Carsten Kohler, Jeroen Meessen, Tjitte Nooitgedagt |
| Rok vydání: |
2008 |
| Předmět: |
|
| Zdroj: |
Photomask Technology 2008. |
| ISSN: |
0277-786X |
| Popis: |
Double Patterning (DP), Spacers and other advanced Litho technologies require an enormous amount of CD and tool data collection and development time for Optical Proximity Correction (OPC) modeling. Unfortunately this process could be started typically only when the Litho and Etch process development for the OPC'ed layer is done. This leads to significant (a month and more) delays with the mask tape-outs and final chip readiness for production. In this paper we discussed a way to reduce the overall OPC and MDP preparation and product-to-market time and increase the OPC accuracy by early collection of the OPC measurements, automatic CD-SEM recipe generation and CD data analysis and model calibration with Tachyon software. We reviewed the design of the OPC test chip, OPC exposures, data analysis and OPC modeling on the advanced and accurate Tachyon T2.0 OPC platform and ways to improve modeling cycle time. Another critical parameter of the OPC modeling is accuracy as one of the main parts of the CD error budget. We investigated approaches to OPC modeling accuracy and achieved RMS below 1nm for critical features by using module data of the respective ASML TWINSCAN XT:1900i scanner and advanced Tachyon software. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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