Thermal Design of an HTP Microthruster
| Autor: | H.M. Sanders, W.H.C. Halswijk, J.L.P.A. Moerel |
|---|---|
| Rok vydání: | 2006 |
| Předmět: |
Microelectromechanical systems
Materials science Fabrication Silicon business.industry Wafer bonding chemistry.chemical_element Hardware_PERFORMANCEANDRELIABILITY Impulse (physics) Propulsion chemistry Hardware_GENERAL Hardware_INTEGRATEDCIRCUITS Electronic engineering Wafer Aerospace engineering business Microscale chemistry |
| Zdroj: | ICMENS |
| DOI: | 10.1109/icmens.2005.124 |
| Popis: | A microscale thruster, has been successsfully designed using MEMS technology, in that 'stacked wafer' design is adopted.The thruster is built up of stacked and bonded silicon wafer, each with its own internal structure. The MEMS technology as succeed in acheiveing good performance and relatively short heat-up transient. This paper describes the preliminary design and detailed thermal analysis. The microthruster is designed to be used on small satellites,to deliver small impulse bits micro/nano-satellites for /spl delta/V impulses. |
| Databáze: | OpenAIRE |
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