Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors

Autor:	Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Katsuaki Suganuma
Rok vydání:	2023
Předmět:	General Physics and Astronomy Surfaces and Interfaces General Chemistry Condensed Matter Physics Surfaces Coatings and Films
Zdroj:	Applied Surface Science. 608:155165
ISSN:	0169-4332
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::261560ba6871e6e9a156514eb7887524 https://doi.org/10.1016/j.apsusc.2022.155165 Zobrazit plný text záznamu Full Text from ScienceDirect