Processing and Characterization of Die-attach on Uncoated Copper by Pressure-less Silver Sintering and Low-pressure-assisted Copper Sintering
| Autor: | Guo-Quan Lu, Xin Li, Meiyu Wang, Yunhui Mei, Yanliang Shan |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Materials science business.product_category business.industry 05 social sciences Metallurgy Sintering chemistry.chemical_element dBc engineering.material 01 natural sciences Copper Semiconductor Coating chemistry Acid gas 0103 physical sciences engineering Shear strength Die (manufacturing) 0501 psychology and cognitive sciences business 050104 developmental & child psychology |
| Zdroj: | 2019 International Conference on Electronics Packaging (ICEP). |
| Popis: | Die-attach by metal-powder sintering is being widely adopted in the power electronics industry for manufacturing power semiconductor discrete devices and modules. Thus far, the most widely practiced process involves pressure-assisted silver sintering on direct-bond copper (DBC) substrates that are surface-finished with a coating of silver or gold. In this paper, sintering die-attach processes were done on native DBC substrates by pressure- less sintering of a silver paste and pressure-assisted sintering of a copper paste. To prevent copper oxidation, the silver die-attach process was done in a mixture of formic- acid gas and air, while the copper process in forming-gas (4%H 2 /N 2 ). The effects of sintering atmosphere, temperature, and pressure on die shear strength were investigated. We achieved strong die-shear strength and oxidation-free sintered bond-line with either bonding process under less stringent demands on materials and processing conditions for low-cost implementation of the die-attach technology in manufacturing. |
| Databáze: | OpenAIRE |
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