Mechanism of snapback failure induced by the latch-up test in high-voltage CMOS integrated circuits

Autor: Ming-Dou Ker, Chung-Ti Hsu, Po-An Chen, Jen-Chou Tseng, Fu-Yi Tsai, Yu-Lin Chen
Rok vydání: 2008
Předmět:
Zdroj: 2008 IEEE International Reliability Physics Symposium.
DOI: 10.1109/relphy.2008.4558958
Popis: An electrical overstress failure induced by a latch-up test is studied in high-voltage integrated cricuits. The latchup test resulted in damage to the output NMOSFET due to snapbach and also resulted in a latch-up in the internal circuits. These mechanisms are analyzed and solutions are proposed to avoid the triggering of the output NMOSFET and the resulting latchup issue.
Databáze: OpenAIRE