Surface Preparation of Tantalum for Encapsulation and Adhesive Bonding
| Autor: | Tiow Lin Tan, K. W. Allen |
|---|---|
| Rok vydání: | 1992 |
| Předmět: |
Materials science
Adhesive bonding Tantalum chemistry.chemical_element Hydrochloric acid Surfaces and Interfaces General Chemistry Silicone rubber Surfaces Coatings and Films chemistry.chemical_compound Distilled water chemistry Mechanics of Materials Surface preparation Sodium hydroxide Boiling Materials Chemistry Composite material |
| Zdroj: | The Journal of Adhesion. 37:63-72 |
| ISSN: | 1545-5823 0021-8464 |
| DOI: | 10.1080/00218469208031250 |
| Popis: | A number of methods of surface preparation of tantalum for encapsulation in silicone rubber and for structural adhesive bonding were explored. The only ones which could be generally useful were boiling for 24 hours in distilled water (28% improvement) or boiling for 4 hours in 20% sodium hydroxide solution followed by boiling for 2 hours in dilute hydrochloric acid (34% improvement). An alternative, which could sometimes be used, was heating in air for at least 2 hours at 100°C. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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