Imprint-Through Mold Via (i-TMV) with High Aspect Ratio and Narrow Pitch for Antenna in Package
| Autor: | Tomoaki Shibata, Tsuyoshi Ogawa, Naoya Suzuki, Toshihisa Nonaka, Xinrong Li, Satoshi Yoneda |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
Materials science
Silicon business.industry chemistry.chemical_element Sintering 020206 networking & telecommunications 02 engineering and technology medicine.disease_cause Electromagnetic interference chemistry EMI Mold Electromagnetic shielding 0202 electrical engineering electronic engineering information engineering medicine Optoelectronics 020201 artificial intelligence & image processing Transient (oscillation) Antenna (radio) business |
| Zdroj: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). |
| DOI: | 10.1109/ectc32862.2020.00032 |
| Popis: | The imprint-Through Mold Via was proposed for electromagnetic interference (EMI) shielding of Antenna in Package (AiP) application. The 300 μm-height via array could be successfully imprinted by using the silicon master which has 743 pillars with the diameter of 100 μm, pitch of 200 μm and height of 370 μm, and the via array was well filled by vacuum printing method with newly developed conductive paste utilizing transient liquid phase sintering. In order to evaluate the electric characteristics of the via array, a daisy-chain test vehicle (TV) which could connect all the vias together was fabricated. In the result of the reliability test, no electrical failure was confirmed of this daisy-chain. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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