Development of new assembly techniques for a silicon micro-vertex detector unit using the flip-chip bonding method
| Autor: | S. Avrillon, H. Hanai, S. Miyahara, Yasuo Higashi, M. Ikeda, Hitoshi Takeuchi, H. Ozaki, Y. Fujita, Shigeki Mori, Yutaka Saitoh, S. Okuno, T. Tsuboyama, Chikara Fukunaga, Junko Yamanaka, J. Haba, M. H. Tanaka, S. Koike, H. Kanazawa, Masaaki Kamiya, Masaaki Mandai, K. Yusa, Hitomi Ikeda, Tomohiro Matsuda |
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| Rok vydání: | 1994 |
| Předmět: |
Physics
Nuclear and High Energy Physics Silicon Physics::Instrumentation and Detectors business.industry Detector chemistry.chemical_element Anisotropic conductive film Integrated circuit law.invention chemistry law Hardware_INTEGRATEDCIRCUITS Optoelectronics High Energy Physics::Experiment Development (differential geometry) Vertex detector business Instrumentation Flip chip |
| Zdroj: | Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 342:298-301 |
| ISSN: | 0168-9002 |
| DOI: | 10.1016/0168-9002(94)91443-5 |
| Popis: | Full-size models of a detector unit for a silicon micro-vertex detector were built for the KEK B factory. The Flip-Chip Bonding (FCB) method using a new type anisotropic conductive film was examined. The structure using the FCB method successfully provides a new architecture for the silicon micro-vertex detector unit. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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