The Use of Crystal Orientation in Mapping the Electrodeposition of Cobalt and Copper
| Autor: | M. A. Ashworth, T. S. Eagleton, M. G. Hall, J. P. G. Farr |
|---|---|
| Rok vydání: | 2000 |
| Předmět: |
010302 applied physics
Auger electron spectroscopy Copper substrate Materials science Morphology (linguistics) 020209 energy Metallurgy Metals and Alloys Crystal orientation chemistry.chemical_element 02 engineering and technology Surfaces and Interfaces Substrate (electronics) Condensed Matter Physics 01 natural sciences Copper Surfaces Coatings and Films Crystallography chemistry Mechanics of Materials 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Cobalt Deposition (law) |
| Zdroj: | Transactions of the IMF. 78:61-64 |
| ISSN: | 1745-9192 0020-2967 |
| DOI: | 10.1080/00202967.2000.11871308 |
| Popis: | SUMMARYThe orientation of the substrate used in electrodeposition has a significant effect on the distribution and morphology of the deposit. This may be particularly important in producing multilayered structures with a short repeat distance.It has been shown that on a multi-crystalline copper substrate the deposition of cobalt takes place preferably on certain orientations, and that little deposition takes place on other orientations. The electrodeposited Co may be either hcp or fcc. When copper is deposited on cobalt, the distribution of growth is relatively independent of the substrate orientation. In this study scanning Auger spectroscopy complemented crystal orientation mapping. |
| Databáze: | OpenAIRE |
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