Effect of Particle Size on Sintering Characteristic of Cu Powder for Termination Electrode of MLCC

Autor:	Nobuyuki Seki, Ryosuke Ueyama, Tamotsu Ueyama
Rok vydání:	2002
Předmět:	Fabrication Materials science Mechanical Engineering Metallurgy Metals and Alloys Sintering Microstructure Industrial and Manufacturing Engineering law.invention Capacitor law visual_art Electrode Materials Chemistry visual_art.visual_art_medium Ceramic Particle size Composite material Shrinkage
Zdroj:	Journal of the Japan Society of Powder and Powder Metallurgy. 49:9-13
ISSN:	1880-9014 0532-8799
DOI:	10.2497/jjspm.49.9
Popis:	The characteristics of Cu powder used for the fabrication of termination electrodes of multilayer ceramic chip capacitors (MLCCs) was evaluated. The effects of particle diameter on the sintering characteristics of Cu powder for use as electrode films were studied. A high tapping density was obtained for all pulverized Cu powders with average particle diameter of 0.5μm, 1.0μm and 5.0μm. The experimental results revealed that pulverized Cu powders were homogeneously dispersed in the paste. From shrinkage measurements in Cu electrode films with thickness of approximately 200μm, which were formed by an applicator and sintered at temperatures from 650°C to 850°C, it was observed that films composed of 0.5μm and 1.0μm Cu powders showed a larger shrinkage than that from 5.0μm Cu powder. A similar result has been observed for the microstructure of sintered electrode films.
Databáze:	OpenAIRE
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