Effects of Diameter on Copper Pillar with Solder Cap Interconnections During Reflow Soldering Process

Autor:	Jing Rou Lee, Mohd Sharizal Abdul Aziz, Mohd Arif Anuar Mohd Salleh, Chu Yee Khor, Mohammad Hafifi Hafiz Ishak
Rok vydání:	2023
Zdroj:	The Minerals, Metals & Materials Series ISBN: 9783031225239
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::23716c5d1dd3bea402a454019854a485 https://doi.org/10.1007/978-3-031-22524-6_84 Zobrazit plný text záznamu