| Autor: |
Kenta Ono, Yuji Okada, Yoshiharu Kariya, Atsushi Fujii |
| Rok vydání: |
2020 |
| Předmět: |
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| Zdroj: |
International Symposium on Microelectronics. 2020:000094-000099 |
| ISSN: |
2380-4505 |
| DOI: |
10.4071/2380-4505-2020.1.000094 |
| Popis: |
In order to improve the performance and reliability of the package, the interlayer dielectric (Polymer) must not be delaminated and materials should not fracture due to thermal stresses during the operation or the manufacturing process. If the reliability of the package can be known in advance by simulation, it can be expected to greatly help in material selection and package design. Firstly, we created material-specific master curves (time–temperature superposition) by considering the measurement results of the Peel Test at the Cu/Polymer interface and the mechanical properties of polymer. The critical Energy Release Rate (𝒢𝒸) could be calculated by its master curve. Secondary, we calculated the Energy Release Rate (𝒢) from Finite Element Analysis (FEA) in the package model structure. Finally, delamination is judged by normalizing 𝒢/𝒢𝒸. This study has made it possible to simulate the delamination possibility of Cu/Polymer interface at arbitrary temperatures and displacement rates from basic material data and FEA analysis of the package model structure. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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