Crystallographic Texture and Phase Formation in Blanket TifriN/AICu Films

Autor: R. F. Schnabe, Stefan J. Weber, P. W. DeHaven, Kenneth P. Rodbell, Roy C. Iggulden, Clevenger Leigh Anne H
Rok vydání: 1998
Předmět:
Zdroj: MRS Proceedings. 514
ISSN: 1946-4274
0272-9172
Popis: Interconnection metallization uses film stacks, often composed of thin ( and and Al reflections for a series of 20 nm Ti/ 10 nm TiN/400 nm AlCu films using both a conventional Siemens D500 diffractometer with a pole figure attachment and a Siemens HI-STAR Area Detector system using Cu radiation from a rotating anode source. Because of overlap between the Al and Ti reflections, the Al was removed with a subtractive etch. In this way both the Al and underlayer film textures could be quantified. It was found that the Ti and Al-alloy film textures vary depending on the deposition temperature, deposition method and final film thickness. For example, an increase in the substrate temperature from 300° to 500°C caused the Ti film texture to change from to . Additionally, switching the TiN deposition process from physical vapor deposition (PVD) sputtering to chemical vapor deposition (CVD) in a Ti/TiN/AlCu film stack caused a degradation in the AlCu texture.
Databáze: OpenAIRE
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