| Autor: |
Hashimoto Keika, Yu Shoji, Takenori Fujiwara, Yutaro Koyama, Yuki Masuda, Ryoji Okuda, Kimio Isobe, Hitoshi Araki, Masao Tomikawa |
| Rok vydání: |
2017 |
| Předmět: |
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| Zdroj: |
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). |
| DOI: |
10.1109/eptc.2017.8277585 |
| Popis: |
In this study, we have developed low-temperature curable positive-tone photo-definable dielectric materials with high elongation property for redistribution layers (RDLs). This high elongation concept introduces a flexible molecular skeleton in the base polymer backbone, which is assumed to increase the entanglement of each polymer chain. In addition, adhesion strength of dielectric materials to copper needed to be enhanced for higher reliability. Furthermore, we have obtained that very fine photo-patterns of the dielectric layer were observed by using advanced laser direct imaging (LDI) exposure tool which is useful for warped panel substrates. This material is expected to be a key material by contributing to the enhancement for the next-generation of semiconductor device packaging reliability, especially, for Fan-out Wafer Level Packages (FOWLP) and Fan-out Panel Level Packages (FOPLP). |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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