Novel 3-D Micro-Coaxial Interconnecting Method for THz Monolithic Microwave Integrated Circuits
| Autor: | Shen Wei, Zhao Jiaqing, Ding Lei, Yan Luo, Chen Guilian |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
Materials science
business.industry Coplanar waveguide 020208 electrical & electronic engineering 020206 networking & telecommunications 02 engineering and technology Integrated circuit Microstrip law.invention Electric power transmission Transmission line law Electromagnetic shielding 0202 electrical engineering electronic engineering information engineering Optoelectronics Coaxial business Microwave |
| Zdroj: | 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT). |
| Popis: | This paper provides a novel 3-D micro-coaxial interconnecting method for multilayer monolithic microwave integrated circuits (MMICs) using rectangular micro-coaxial transmission lines. Compared to traditional microstrip or coplanar waveguide transmission lines, the rectangular micro-coaxial transmission line offers lower loss, lower weight, higher power capacity and better shielding characteristics. Hence, the rectangular micro-coaxial transmission line is an ideal candidate for signal transmission especially for MMICs in THz range. Moreover, the micro-coaxial transmission line could realize vertical interconnections, replacing high loss via holes. In this paper, a multilayer MMICs system was demonstrated using the proposed 3-D interconnecting method. Finite-element analysis was carried out to compare the electrical performance of the proposed multilayer MMICs with rectangular micro-coaxial transmission lines to that using traditional microstrip and via holes. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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