Pre-fabricated High-density TSV Interposer for Programmable IC Applications

Autor:	T. Y. Ouyang, Y. T. Hung, O. H. Lee, S. Y. Li, W. L. Chiu, T. Y. Hung, S. H. Wu, H. H. Chang
Rok vydání:	2022
Zdroj:	2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
DOI:	10.1109/impact56280.2022.9966630
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2236107c7830d30478e11455b7526682 https://doi.org/10.1109/impact56280.2022.9966630 Zobrazit plný text záznamu