Investigation of the influence of the parameters of the temporary bonding and thinning operations on the bending of silicon wafers

Autor:	Nikolay Djuzhev, Maksim Makhiboroda, Evgeney Gusev, Michael Fomichev, Anna Dedkova, Pavel Ivanin
Rok vydání:	2022
Zdroj:	International Conference on Micro- and Nano-Electronics 2021.
DOI:	10.1117/12.2623584
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::221b38e2de0768dba09250235d94757f https://doi.org/10.1117/12.2623584 Zobrazit plný text záznamu