Metrology Needs for 2.5D/3D Interconnects

Autor:	Larry Smith, Richard A. Allen, Klaus Hummler, Brian Sapp, Steve Olson, Victor Vartanian
Rok vydání:	2014
Předmět:	Interferometry Materials science Optics Aspect ratio Through-silicon via Wafer thinning Wafer bonding business.industry Acoustic microscopy Optoelectronics business Metrology
Zdroj:	Handbook of 3D Integration
DOI:	10.1002/9783527670109.ch29
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::22038d81a6c357d85b5c23cd00f6d11c https://doi.org/10.1002/9783527670109.ch29 Zobrazit plný text záznamu