Design and Technological Peculiarities of Flip-chip Mounting in the Production of Highly Integrated 2.5D and 3D Microassemblies

Autor:	N Sidorenko Vitaliy, A Kovalev Anatoliy, P Timoshenkov Sergey, G Dolgovykh Yuriy, V Vertyanov Denis, V Zmeev Sergey
Rok vydání:	2018
Předmět:	Computer science business.industry Electrical engineering Production (economics) business Flip chip
Zdroj:	Nanoindustry Russia. :203-210
ISSN:	1993-8578
DOI:	10.22184/1993-8578.2018.82.203.210
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::21f263680b00dfcb8d03da302890e20d https://doi.org/10.22184/1993-8578.2018.82.203.210 Zobrazit plný text záznamu