Non-Melt Ultrasonic Bonding Method for Polymer MEMS Devices

Autor:	Qing Qiang He, Cao Qing Yan, Zong Bo Zhang
Rok vydání:	2014
Předmět:	chemistry.chemical_classification Nanoelectromechanical systems Materials science chemistry Bonding strength Microfluidics Thermal Ultimate tensile strength Polymer mems General Medicine Polymer Ultrasonic bonding Composite material
Zdroj:	Applied Mechanics and Materials. 607:133-138
ISSN:	1662-7482
DOI:	10.4028/www.scientific.net/amm.607.133
Popis:	Based on the theoretical study in our previous work, a novel thermal assisted ultrasonic bonding method for polymer Micro/nanoElectro-Mechanical Systems (M/NEMS) has been demonstrated. Bonding experiments of PMMA microfluidic chips with micro-channel of 80 μm in depth and width were conducted. The result shows numerous superiorities of this method including high bonding strength (0.95 MPa), low dimension loss (0.8% in depth and 0.3% in width, respectively) and short bonding duration.
Databáze:	OpenAIRE
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