Correlation between Interfacial Microstructure and Conditions of Bonding in Carbon Fibre-Copper Composites

Autor: Władysław Włosiński, K. Pietrzak, W. Olesińska, D. Kaliński
Rok vydání: 1995
Předmět:
Zdroj: Advanced Composites Letters. 4:096369359500400
ISSN: 2633-366X
DOI: 10.1177/096369359500400205
Popis: Carbon fibre reinforced copper matrix composites have been produced to provide materials with high thermal conductivity for use in semiconductors (diodes and thyristors) and electrical contacts. The problem of poor wettability of the carbon fibres by the copper matrix was overcome by admixing the matrix with zirconium which react with the carbon fibres to form carbides. The amount of carbides formed in the interface layer and, thus, the properties of the composite can be controlled by controlling the amount of the active element added, or by modifying appropriately the process parameters. This latter method has been examined in the present study. The experimental results have been verified by calculating and analysing the thermodynamic parameters of the process.
Databáze: OpenAIRE