Ka-Band AiP Array in Mold-on-Mold FOWLP technology

Autor:	Sun Mei, Lim Teck Guan, Zhou Lin, Zheng Kai Bo, Jong Ming Chinq, Lau Boon Long
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc56328.2022.10013284
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2140447578a08a82480e7e6362e49691 https://doi.org/10.1109/eptc56328.2022.10013284 Zobrazit plný text záznamu