A direct‐writing approach to the micro‐patterning of copper onto polyimide

Autor: Duncan Paul Hand, J.H.-G. Ng, Marc P.Y. Desmulliez, B.G. Moffat, Marco Lamponi, H. Suyal, Kevin Alan Prior, Aongus McCarthy, A. C. Walker
Rok vydání: 2009
Předmět:
Zdroj: Circuit World. 35:3-17
ISSN: 0305-6120
DOI: 10.1108/03056120910953268
Popis: PurposeThe purpose of this paper is to present a novel manufacturing process that aims to pattern metal tracks onto polyimide at atmospheric pressure and ambient environment. The process can be scaled up for industrial applications.Design/methodology/approachFrom a thorough literature survey, different approaches were carried out for processing polyimide. Following a design of experiments for the processing and various characterisation techniques, a micro‐coil was manufactured as a test demonstrator.FindingsThe characteristics of some main formaldehyde‐based electroless copper baths were compared. The quality of the sidewalls was characterised and the performance of the process was assessed.Originality/valueThis paper demonstrates a high‐value manufacturing technique that is mass manufacturable, low cost and suitable for use on 3D surfaces. Criteria required for the development of a direct‐writing process have been described. The issues surrounding electroless plating on polyimide have been explained.
Databáze: OpenAIRE