RF MEMS switch with double-clamp and wafer level package with through silicon vias for integration RF MEMS in applications 5G and internet of things
| Autor: | Alexey V. Tkachenko, Igor E. Lysenko, Andrey V. Kovalev |
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| Rok vydání: | 2022 |
| Zdroj: | International Conference on Micro- and Nano-Electronics 2021. |
| Databáze: | OpenAIRE |
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