| Popis: |
This paper reports wafer level trace metal concentrations from typical lithography processing and models the process from bulk materials concentrations in order to establish meaningful material specifications. Working from a simple deposition model, we determined the critical volume responsible for a surface metal concentration. Using literature derived spin coat models, we explore how this critical volume can be explained by the spin coat process mechanisms. Results are reported using typical post pattern transfer photoresist removal steps: a photoresist ash step and a sulfuric/peroxide clean. Using the surface level results, a comparison is made to the SIA roadmaps, as well as effects on general transistor characteristics, to draw conclusions on the impact to device performance. |
