| Autor: |
Zhangming Zhou, David Shaddock, R. Wayne Johnson, Zhenzhen Shen, Liang Yin |
| Rok vydání: |
2013 |
| Předmět: |
|
| Zdroj: |
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000213-000219 |
| ISSN: |
2380-4491 |
| Popis: |
Demonstrating functional reliability testing of high temperature electronic devices for long lifetime at 300°C requires electrical test fixtures with even better reliability. Advances in complexity of SiC devices and the need for increased accelerated tests motivate the need for a reliable test fixture at high temperature. The design, fabrication and testing of a prototype test board using commercially available materials shows stability beyond 2000 hours. The approach uses an alumina circuit board with thick film conductors interconnecting an array of BeNi contacts to surface pads. The pads are connected to high temperature wires using spring loaded contacts so that the circuit board may be removed. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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