| Autor: |
Horst Gieser, Waltraud Hell, Gerhard Klink, Andreas Drost, Christoph Kutter, H. Wolf, Erwin Yacoub-George, Karlheinz Bock, Dieter Bollmann, Christof Landesberger |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
2014 IEEE 64th Electronic Components and Technology Conference (ECTC). |
| Popis: |
In this paper we present a technology developed for reliable electrical interconnection on film substrates and between vertically stacked film layers. Applying through-hole via technologies for 3D foil stacks enables multi-functionality and RF performance combined with open form-factor and very cost-efficient manufacturing of conformable electronic modules. The manufacture of fine line metal patterns (line /space geometries below 20μm) on film substrates is performed by cost-effective roll-to-roll technology. Furthermore procedures and technologies for handling and lamination of film based sub-modules have been developed. Also the manufacture and handling of ultra-thin and flexible integrated circuits has been combined with placement of SMD type passive and with integrated printed passive components in the same technology. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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