Organic Panel Fine Circuit Pattern Inspection and Metrology for Readiness

Autor:	Feng Xue, Charles Reynolds, Tom Wassick, Glenn Pomerantz, Zhihua Zou, Anna Lucy Santos, Neil Tang, Alison Yu-Ting Lin, Channing Cheng-Lin Yang, Jing-Sian Huang, Billy Chung-Yu Cheng, Masahiro Tsuriya
Rok vydání:	2021
Zdroj:	2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc53413.2021.9663960
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1f517099f692c75f09c2e6448b7f7d7c https://doi.org/10.1109/eptc53413.2021.9663960 Zobrazit plný text záznamu