Dummy Poly Removal Impact Factors and Improvement in Hkmg Last Process

Autor:	Shao Feng Yu, Yi Zhi Zeng, Qin Zhang, Han Jie Gao, HX Liu, Jie Zhao, Jialei Liu, Woei Ji Song, Kurban Awuti, YiHui Lin
Rok vydání:	2014
Předmět:	business.industry Computer science technology industry and agriculture Process (computing) Process engineering business human activities
Zdroj:	ECS Transactions. 60:709-713
ISSN:	1938-6737 1938-5862
DOI:	10.1149/06001.0709ecst
Popis:	For 20/16nm HK-last and MG-last process, Dummy poly is removed by Wet process. This paper studies the factors impacting the dummy poly removal process, and presents some models to explain the impacting factors. Implant process is one of main factors influencing dummy poly removal capability because the differences of implant ions and doping amount into dummy poly induce difference of poly removal rate by wet process. We also study poly surface single clean, multiple clean and thermal process. Based on the model, we plan N-type doping poly and P-type doping poly with different ion doping amounts on blank wafer and 20nm structure wafers to evaluate dummy poly removal. We find dummy poly removal rate is different between N-type doping poly and P-type doping poly, and receive different dummy poly removal trend by ion amount on N-type doping poly and P-type doping poly. The model can help to improve dummy poly removal process control.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1f2394f001ae698c1e6d63869a1a5431 https://doi.org/10.1149/06001.0709ecst Zobrazit plný text záznamu