Ultraprecise Deposition of Micrometer-Size Conductive Features for Advanced Packaging

Autor:	Aneta Wiatrowska, Piotr Kowalczewski, Karolina Fiaczyk, Lukasz Witczak, Jolanta Gadzalinska, Mateusz Lysien, Ludovic Schneider, Lukasz Kosior, Filip Granek
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1ef485c5fc7cfed6d7c9d871cf5d7ad0 https://doi.org/10.1109/ectc51906.2022.00251 Zobrazit plný text záznamu