Ultraprecise Deposition of Micrometer-Size Conductive Features for Advanced Packaging

Autor: Aneta Wiatrowska, Piotr Kowalczewski, Karolina Fiaczyk, Lukasz Witczak, Jolanta Gadzalinska, Mateusz Lysien, Ludovic Schneider, Lukasz Kosior, Filip Granek
Rok vydání: 2022
Zdroj: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
DOI: 10.1109/ectc51906.2022.00251
Databáze: OpenAIRE