The Development and Use of Thin Film Thermocouples for Contact Temperature Measurement
Autor: | J. J. Deacutis, F. E. Kennedy, Albert K. Henning, X. Tian |
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Rok vydání: | 1992 |
Předmět: |
Materials science
Mechanical Engineering chemistry.chemical_element Surfaces and Interfaces Substrate (electronics) Chemical vapor deposition Temperature measurement Copper Surfaces Coatings and Films chemistry Mechanics of Materials Thermocouple visual_art Heat generation visual_art.visual_art_medium Electronic engineering Ceramic Thin film Composite material |
Zdroj: | Tribology Transactions. 35:491-499 |
ISSN: | 1547-397X 1040-2004 |
Popis: | A procedure was developed for producing thin film thermocouples (TFTC) on the contact surface of sliding mechanical components. The thermocouple devices were made from thin films of vapor-deposited copper and nickel. The measuring junctions of the thermocouples were approximately 2 μm thick and between 80 μm and 300 μm across. The TFTC devices were found to have extremely rapid (< 1 μS) response to a sudden temperature change and did not significantly disturb the heat flow from the sliding contact. It was found necessary to sandwich the TFTC between thin films of a hard, non-conducting ceramic (Al2O3 in the current work) to insulate the thermocouple electrically from the substrate and protect it during sliding. Thin film thermocouple devices were applied to the measurement of sliding surface temperatures in two cases, oscillatory dry sliding of a polymer pin on a flat surface, and uni-directional dry sliding of a ring over a flat pin surface. Results from the tests verified theoretical predictions. Presen... |
Databáze: | OpenAIRE |
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