Packaging of optoelectronics and passive optics for intrasystem interconnects

Autor:	G.J. Grimes, G.L. Sonnier, J.S. Helton, W.K. Honea, C.J. Sherman
Rok vydání:	2002
Předmět:	Multi-mode optical fiber Backplane business.industry Computer science Embedded system Single-mode optical fiber Electronic engineering Integrated circuit packaging Interconnection density business
Zdroj:	Proceedings of LEOS'94.
Popis:	Summary form only given. Optical backplanes can enhance the functionality of large system products at reasonable cost. In order to further exploit high technology, high fibre count multivendor multifiber array backplane connectors are needed. Intermateability at the backplane is a key goal. This should not preclude a wide variety of packaging approaches on both sides of the backplane. Standard multimode and single mode fibers should be supported, along with specialty fibers if desired. Two dimensional arrays with high fiber counts will be particularly useful. Backplane interconnection density is crucial and multifiber array connectors are powerful tools in this area.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1ec037ece7c1e67189bcd69fc3ddf0c9 https://doi.org/10.1109/leos.1994.586973 Zobrazit plný text záznamu