Autor:	S. Slupsky, Brian Moore, K. Iniewski, C. Sellathamby
Rok vydání:	2008
Předmět:	Engineering Transmission (telecommunications) business.industry Wireline Bandwidth (computing) Electronic engineering Wireless Throughput Terabit Transceiver Chip business
Zdroj:	APCCAS
DOI:	10.1109/apccas.2008.4746331
Popis:	I/O data throughput remains a bottleneck in high-speed chip to chip data communication. This paper discusses the latest technical innovations in increasing the I/O bandwidth while reducing energy per transition. Both wireline techniques that include DSP processing and equalization, and wireless transmissions that include on-chip inductive and capacitive coupling are discussed and compared.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1ea377a8df902b6de944dbf8b7f52c92 https://doi.org/10.1109/apccas.2008.4746331 Zobrazit plný text záznamu