3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs
| Autor: | Jean-Marie Dorkel, T. Azoui, Philippe Dupuy, Laurent Guillot, Patrick Tounsi |
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| Rok vydání: | 2011 |
| Předmět: |
Wire bonding
Materials science Thermal runaway Mechanical engineering Condensed Matter Physics Atomic and Molecular Physics and Optics Finite element method Surfaces Coatings and Films Electronic Optical and Magnetic Materials Power (physics) Reliability (semiconductor) MOSFET Electronic engineering Electrical and Electronic Engineering Power MOSFET Safety Risk Reliability and Quality Contact area |
| Zdroj: | Microelectronics Reliability. 51:1943-1947 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2011.06.018 |
| Popis: | This paper presents a methodology, based on 3D electro-thermal simulation, to investigate failures of vertical power MOSFET due to metallization ageing of source terminal. Modelling steps to obtain a 3D finite element modelling of MOSFET are presented with the smart approximations and limitations of MOSFET electrical behaviour. The effects of bonding wire gauge and contact area with top metallization are studied to optimize the power device design. The power device thermal runaway phenomenon and hot spot formation has been simulated and discussed. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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