Application of Superplasticity in Solder Joints

Autor:	M. C. Shine, J. W. Morris, J. Seyyedi, T. Massingill, Z. Mei
Rok vydání:	1990
Předmět:	Equiaxed crystals Quenching Materials science Soldering Metallurgy Superplasticity Deformation (engineering) Grain structure Eutectic system
Zdroj:	MRS Proceedings. 203
ISSN:	1946-4274 0272-9172
DOI:	10.1557/proc-203-425
Popis:	The lifetime of non-compliant eutectic solder joints was improved by an order magnitude by rapid quenching. The quenching produces a fine equiaxed superplastic grain structure which lowers the stresses in the solder joints for the fatigue cycle strain range. Similarly, compliant J Bend and Gull wing joints, which last thousands of cycles, operate at lower stresses where superplastic deformation predominates.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1e57ba4ce62ea138bb73f91537775db5 https://doi.org/10.1557/proc-203-425 Zobrazit plný text záznamu Full text from SpringerLink