Simulation of structure evolution in Cu films
| Autor: | Chia-Jeng Chung, Ross G. Johnson, No-Jin Park, David P. Field |
|---|---|
| Rok vydání: | 2009 |
| Předmět: |
Materials science
Condensed matter physics Annealing (metallurgy) Monte Carlo method Metals and Alloys Surfaces and Interfaces Microstructure Surfaces Coatings and Films Electronic Optical and Magnetic Materials Condensed Matter::Materials Science Crystallography Grain growth Condensed Matter::Superconductivity Materials Chemistry Grain boundary Crystallite Crystal twinning Electron backscatter diffraction |
| Zdroj: | Thin Solid Films. 517:1977-1982 |
| ISSN: | 0040-6090 |
| DOI: | 10.1016/j.tsf.2008.11.068 |
| Popis: | The Monte Carlo method was used to simulate grain growth in thin Cu films. The model, based on energetic principles, was compared with the evolution of measured film structures. Surface, interface, grain boundary, and elastic strain energies were applied to determine the preferred microstructure in terms of different annealing conditions and film thicknesses. Four microstructural cases, relating to different film thicknesses, were developed in this paper. Twinning in the Cu films is simulated by arbitrary re-assignment of randomly selected crystallite lattice orientations. The observed evolution in crystallographic texture for each film thickness can be obtained from the Monte Carlo simulations. |
| Databáze: | OpenAIRE |
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