| Autor: |
Annie Hu, Ben-Je Lwo, Zhong-Yi Wu, Harrison Chung, Jeff Kao, Pei-Hsuan Wu, Richard Chen, Robert Lee |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
| DOI: |
10.1109/impact.2014.7048393 |
| Popis: |
In this paper, we perform thermal and thermo-stress analyses on diode packaging with both currently used (traditional) and the newly designed (Zowie) structures in a 5W power adapter. To this end, a global-local methodology with ANSYS FEM software were employed with the equivalent material property equations, and temperature distribution measurements were simultaneously carried out for verification and extracting boundary conditions. The simulated mechanical behaviors on the two packaging designs are finally compared with discussions in this study. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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