Electroplating Cu Filling Study for Thorough Electrode in Silicon Wafer of Three Dimensional LSI Chip Stacking
| Autor: | Hitoshi Yonemura, Manabu Tomisaka, Kenji Takahashi, Masataka Hoshino |
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| Rok vydání: | 2001 |
| Předmět: | |
| Zdroj: | Extended Abstracts of the 2001 International Conference on Solid State Devices and Materials. |
| DOI: | 10.7567/ssdm.2001.b-1-3 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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