Investigation on Package Warpage and Reliability of the large size 2.5D Molded Interposer on Substrate (MIoS) Package
| Autor: | Soohyun Nam, Jinhyun Kang, Ilbok Lee, Younglyong Kim, Hae Jung Yu, Dae-Woo Kim |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). |
| DOI: | 10.1109/ectc51906.2022.00108 |
| Databáze: | OpenAIRE |
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