A11 Development of Grinding Machine for 450mm Wafer : 1^ report: Specification and Fundamental Performance of The Grinding Machine

Autor:	Go Okahata, Akinori Yui, Shigeki Okuyama, Tomoyuki Koiwai, Takayuki Kitajima, Ayumu Honda, Hisashi Kobayashi
Rok vydání:	2012
Předmět:	Engineering Development (topology) business.industry Mechanical engineering Wafer business Manufacturing engineering Grinding
Zdroj:	The Proceedings of The Manufacturing & Machine Tool Conference. :31-32
ISSN:	2424-3094
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1d3de2abae575cd53c2c2da835e3974f https://doi.org/10.1299/jsmemmt.2012.9.31 Zobrazit plný text záznamu