The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5Cu solder alloy
| Autor: | Suhana Mohd Said, Mohammad Hossein Mahdavifard, Dhafer Abdulameer Shnawah, Irfan Anjum Badruddin, Mohd Faizul Mohd Sabri, Shaifulazuar Rozali |
|---|---|
| Rok vydání: | 2015 |
| Předmět: |
Materials science
Scanning electron microscope Metallurgy chemistry.chemical_element Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Bismuth Precipitation hardening chemistry Soldering Ultimate tensile strength Melting point Electrical and Electronic Engineering Safety Risk Reliability and Quality Supercooling Ductility |
| Zdroj: | Microelectronics Reliability. 55:1886-1890 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2015.06.134 |
| Popis: | This work investigates the effect of Fe and Bi addition, 0.05 wt.% Fe and 1 wt.% or 2 wt.% Bi, on the microstructural, mechanical, and thermal properties of the low silver Sn–1Ag–0.5Cu (SAC105) solder alloy. Adding Bi and Fe to SAC105 increased ultimate tensile strength (UTS) and yield strength and decreased the total elongation which is related to solid-solution and precipitation strengthening effects by Bi in the Sn-rich phase. While 0.05 wt.% Fe made few FeSn2 in the solder bulk which does not have considerable effect on mechanical properties. Scanning electron microscopy (FESEM) and energy dispersive X-ray (EDX) showed that Bi strengthen solder by scattering in the bulk of SAC105-Fe solder alloy, thereby increased β-Sn and degenerated Cu6Sn5 and Ag3Sn into a chain-like arrangement. Surface fracture of SAC–Fe–Bi solder alloys showed brittle fracture because Bi prevented β-Sn to deform and therefore Bi decreased its ductility. Finally, Bi significantly reduces the melting point and undercooling. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|
Full Text from ScienceDirect