Finite element model verification for packaged printed circuit board by experimental modal analysis
| Autor: | Yi-Shao Lai, Bor-Tsuen Wang, Chang-Lin Yeh, Ying-Chih Lee, Rong-Sheng Chen |
|---|---|
| Rok vydání: | 2008 |
| Předmět: |
Engineering
business.industry Modal analysis Electronic packaging Natural frequency Structural engineering Condensed Matter Physics Drop test Atomic and Molecular Physics and Optics Finite element method Surfaces Coatings and Films Electronic Optical and Magnetic Materials Printed circuit board Modal Electronic engineering Boundary value problem Electrical and Electronic Engineering Safety Risk Reliability and Quality business |
| Zdroj: | Microelectronics Reliability. 48:1837-1846 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2008.07.068 |
| Popis: | In this work, the experimental modal analysis (EMA) was performed to establish an equivalent finite element (FE) model for a standard Joint Electron Device Engineering Council (JEDEC) drop test printed circuit board (PCB) mounted with packages in a full array. Material properties of the equivalent FE model of the packaged PCB were calibrated through an optimization process with respect to natural frequencies based on EMA results obtained with a free boundary condition. The model was then applied to determine screwing tightness of the packaged PCB corresponding to a fixed boundary condition with the four corners of the PCB constrained, as defined by JEDEC for a board-level drop test. Modal damping ratios of the packaged PCB were also provided. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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