A New FOWLP Platform for Hybrid Optical Packaging - Demonstration on 100Gbps Transceiver

Autor:	David Dongwoo Park, Sukyoon Oh, Seungman Han, Yoonyoung Bae, Seong-Wook Choi, Young June Park
Rok vydání:	2021
Předmět:	Optical fiber Wafer-scale integration Materials science Silicon business.industry chemistry.chemical_element Fan-out law.invention Small form factor Semiconductor chemistry law Hardware_INTEGRATEDCIRCUITS Optoelectronics Transceiver business Wafer-level packaging
Zdroj:	OFC
DOI:	10.1364/ofc.2021.m2b.1
Popis:	The Fan Out Wafer Level Packaging, widely used in the silicon semiconductor system, is introduced for all-in-one hybrid optical package with small form factor, potentially higher performance, and expendability to on-board/co-packaged optical interconnections. To prove the new packaging idea, 100GBASE-SR4 standard is targeted in this demonstration.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1ccb55b5398390ebc5e5e17a7f627fb2 https://doi.org/10.1364/ofc.2021.m2b.1 Zobrazit plný text záznamu