Metallization and photolithographic processes and procedures for MC2730 RTG thermopile intraconnections

Autor:	R.E. Wright, G.L. Knauss, E.E. Komarek
Rok vydání:	1974
Předmět:	Materials science Fabrication business.industry Oxide chemistry.chemical_element Polishing Tungsten Photoresist Thermopile chemistry.chemical_compound chemistry Thermocouple Electronic engineering Optoelectronics Thin film business
DOI:	10.2172/7192063
Popis:	Processes and procedures were developed for applying the thin film tungsten electrical intraconnections to the MC2730 RTG ''one-dimensional'' thermopile. After polishing, the surface to be metallized was cleaned with a detergent/organic solvent procedure and then etched with hydrofluoric acid to minimize the oxide. Tungsten contacts were sputtered onto the thermopile and the individual contacts photolithographically defined using a negative acting photoresist in conjunction with a potassium ferricyanide etchant. The processes were used to process 89 thermopiles with an 80 percent effective yield.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1c70b9c7845572e4f3ea2cf9a2702775 https://doi.org/10.2172/7192063 Zobrazit plný text záznamu