An Open Inter-Chiplet Communication Link: Bunch of Wires (BoW)
| Autor: | Bapiraju Vinnakota, Suresh Subramaniam, Ken Poulton, Shahab Ardalan, Ramin Farjadrad, Mark Kuemerle |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
SIMPLE (military communications protocol)
business.industry Computer science Interface (computing) Process (computing) Electrical engineering Communication link 02 engineering and technology 020202 computer hardware & architecture Hardware and Architecture 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering business Software |
| Zdroj: | IEEE Micro. 41:54-60 |
| ISSN: | 1937-4143 0272-1732 |
| DOI: | 10.1109/mm.2020.3040410 |
| Popis: | Bunch of wires (BoW) is a new open die-to-die (D2D) interface that aims to gracefully tradeoff performance for design and packaging complexity across a wide range of process nodes. BoW performance can range from 320 Gb/s/mm with a simple design and packaging to 1+ Tb/s/mm with complex design and/or packaging. BoW directly enables heterogeneous integration, a primary advantage of chiplets. We discuss progress on BoW based on extensive design and performance studies by engineers from multiple companies. These studies aim to make BoW easy to use in a system. This open innovation project will deliver a low-complexity D2D interface with competitive power-performance metrics with the economies of scale for services and technologies associated with an open ecosystem. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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