Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints
| Autor: | F. Feustel, E. Meusel, Steffen Wiese |
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| Rok vydání: | 2002 |
| Předmět: |
Materials science
Metallurgy Metals and Alloys Condensed Matter Physics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Stress (mechanics) Shear (sheet metal) Hysteresis Creep Soldering Displacement (orthopedic surgery) Electrical and Electronic Engineering Instrumentation Flip chip Eutectic system |
| Zdroj: | Sensors and Actuators A: Physical. 99:188-193 |
| ISSN: | 0924-4247 |
| DOI: | 10.1016/s0924-4247(01)00880-9 |
| Popis: | The constitutive behaviour of Sn96.5Ag3.5, Sn95.5Ag4Cu0.5 and Sn63Pb37 solder was investigated on ultra small flip chip solder joints ( V =1×10 −12 m 3 ). In order to run experiments on these small specimens, a micro shear tester has been designed. The tester is optimised to achieve high precision. It is able to record force displacement hysteresis with a resolution of better than 1 mN and 20 nm for force and displacement measurements, respectively. It was found that the creep behaviour of the lead-free solders exhibit a very high dependence on stress (Sn96.5Ag3.5: n =11; Sn95.5Ag4Cu0.5: n =18), while the eutectic SnPb showed a low stress dependence of n =2. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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