Selective formation of an ultra-thin pore seal on mesorporous low-k for a copper dual damascene structure

Autor:	Kazuo Kohmura, Shoko Ono, Hirofumi Tanaka, Tsuneji Suzuki, Yasuhisa Kayaba
Rok vydání:	2014
Předmět:	Spin coating Materials science chemistry Chemical engineering Sealant Copper interconnect chemistry.chemical_element Thermal stability Adhesive Mesoporous material Copper Layer (electronics)
Zdroj:	IEEE International Interconnect Technology Conference.
DOI:	10.1109/iitc.2014.6831890
Popis:	A strategy for the selective formation of a pore sealing layer on mesoporous low-k applicable for a Cu dual damascene interconnection process is herein proposed. An ultra-thin, adhesive, and conformal pore sealing layer was formed on mesoporous low-k by spin coating macromolecules. The pore sealant on the Cu surface was selectively decomposed with the help of Cu 2 O induced oxidization. This selective removal was also examined for patterned structure. Our simple and novel technique will help the integration of ulta-low-k materials in LSI devices.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1c1492caa04d3e506febd4cb0e948f93 https://doi.org/10.1109/iitc.2014.6831890 Zobrazit plný text záznamu