Monolithic Integration of a Micropin-Fin Heat Sink in a 28-nm FPGA
| Autor: | Abdur Rahman, Yang Zhang, Muhannad S. Bakir, Thomas E. Sarvey, Colman Cheung, Aravind Dasu, Gutala Ravi Prakash |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Convection Materials science business.industry Thermal resistance Electrical engineering 02 engineering and technology Heat sink 021001 nanoscience & nanotechnology 01 natural sciences Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials Coolant Fin (extended surface) Heat generation 0103 physical sciences Stratix Optoelectronics Electrical measurements Electrical and Electronic Engineering 0210 nano-technology business |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1617-1624 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2017.2740721 |
| Popis: | Microfluidic cooling has been demonstrated as an effective means of cooling microelectronic circuits with a very low convective thermal resistance and potential for integration in close proximity to the area of heat generation. However, microfluidic cooling experiments to date have been limited to silicon with resistive heaters representing the heat generating circuitry. In this paper, a micropin-fin heat sink is etched into the back side of an Altera Stratix V field-programmable gate array (FPGA), built in a 28-nm CMOS process. Thermal and electrical measurements are made running a benchmark pulse compression algorithm on the FPGA. Deionized water is used as a coolant with flow rates ranging from 0.15 to 3.0 mL/s and inlet temperature ranging from 21 °C to 50 °C. An average junction-to-inlet thermal resistance of 0.07 °C/W is achieved. |
| Databáze: | OpenAIRE |
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