| Autor: |
Johnson Lin, Dirk Zhou, Bin Yu, Yuedong Qiu, Leslie Huang, Jiao Lv, Zhanyi Qian, Cheng Tar Wu, Cheng Chung Lin, Yen Heng Chen |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 China Semiconductor Technology International Conference (CSTIC). |
| DOI: |
10.1109/cstic.2019.8755626 |
| Popis: |
SmartPoserTM, a 3D-SiP platform of integrating the entire power delivery subsystem into the package will be unveiled. SmartPoserTM can accommodate the active power dies and passive SMT components directly underneath the computing die in a 3D stack by using non-TSV Vertical-InterConnect (V-IC) technology. The SmartPoserTM platform has successfully realized a novel 5G mm-Wave ultra-wideband AiP for the first time in semiconductor history named SmartAiPTM.The SmartAiPTM features ultra-wideband from 25GHz to 43GHz and high gain (max 12.5dB broadside) characteristics. The low return loss performance in ultra-wideband is owing to precise wafer-level processing. Further tweak to enclose the 24GHz with low return loss coverage when integrated with transceiver is expected from simulation. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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