Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment
| Autor: | Barry O'Brien, Ke Long, Gregory B. Raupp, Edward J. Bawolek, Jeff Dailey, Hanna M. Haverinen, Sameer M. Venugopal, Nicholas Colaneri, David R. Allee, Curt Moyer, Dirk Bottesch, Nick R. Munizza, Shawn M. O'Rourke, Scott K. Ageno, Douglas E. Loy, Michael Marrs, Jann Kaminski |
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| Rok vydání: | 2007 |
| Předmět: |
Amorphous silicon
Materials science Inkwell Cholesteric liquid crystal business.industry Electrical engineering Atomic and Molecular Physics and Optics Line (electrical engineering) Electronic Optical and Magnetic Materials chemistry.chemical_compound chemistry Backplane Thin-film transistor Flexible display OLED Optoelectronics Electrical and Electronic Engineering business |
| Zdroj: | Journal of the Society for Information Display. 15:445 |
| ISSN: | 1071-0922 |
| DOI: | 10.1889/1.2759549 |
| Popis: | — A low-temperature amorphous-silicon (a-Si:H) thin-film-transistor (TFT) backplane technology for high-information-content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high-performance active-matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible-display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6-in. wafer-scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low-temperature (180°C) a-Si:H process on the 6-in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless-steel substrates, to form factor scale-up of the TFT arrays, and finally manufacturing scale-up to a Gen 2 (370 × 470 mm) display-scale pilot line, will be reviewed. |
| Databáze: | OpenAIRE |
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